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简要描述：超高精度倒装芯片贴片机 CB-700特点：? Ultra-low load, high-accuracy bonding? Real-time control is possible in the low load range. As a result, bump height variation become minimized.
产物型号：厂商性质：生产厂家更新时间：2024-11-07访&苍产蝉辫;&苍产蝉辫;问&苍产蝉辫;&苍产蝉辫;量：1413相关文章
Related Articles详细介绍
| 功能：贴片应用：倒装焊 特点： • Ultra-low load, high-accuracy bonding • Real-time control is possible in the low load range. As a result, bump height variation become minimized. • Supports ultrasonic bonding by exchanging tools • Available process: ACF、ACP、NCF、NCP、Au-Sn (Eutectic),Au-Au (Ultrasonic),Solder Standard Item & Optional Items [Standard Items] • Flip chip unit • Constant heat stage • ATC（Automatic ceramic tool change) • Calibration • Process management(logger/export to another PC) • Automatic leveling mechanism • ID Reading ＜Optional Items＞ • Eutectic head ( No heating) • Eutectic purge jig • Eutectic stage (52mm pulse heater) • Transfer function( Flux, Paste) • Dispenser unit (except dispenser) • Die bonding • Chip imaging camera • Gel pack • Ultrasonic bonding |
超高精度倒装芯片贴片机 CB-700
项目 | 规格参数 |
芯片尺寸 | 0.3x0.3~30X30mm |
基板尺寸（W X L) | 200X200 mm 基板 或8英寸 晶圆 |
邦定力度 | 长负载范围：0.049~4.9N 高负载范围：4.9~1000N |
贴片精度 | ±0.5[μm](3σ) |
贴片平台 | 恒温加热台 RT ~ 250℃ |
设备尺寸 | 1320（W） X 2120（D） X 1815（H）mm |
超高精度倒装芯片贴片机 CB-700
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